TR technology is short name of “Tiling ribbon technology”, which is patented technology of Jinko. Common ribbons are flat, but Jinko uses circular ribbon.The main purpose of using TR technology is that it can eliminate cell gap to increase module efficiency significantly.
What is the TR technology?
TR is actually a combination of two technologies. Firstly, T means Tiling, you can imagine stacking the edges of two silicon wafers on top of each other, so the surface of the finished product has no gaps if you look carefully.
Compared to the conventional interconnection method, tiling ribbon process has a seamless welding and much larger effective inner space, which translates into more performance and drive current.
Secondly, R means ribbon. Common ribbons are flat, however, Jinko update it and use circular ribbon, which is developed by Jinko R&D independently to achieve the reutilization of light absorption and increase energy generation. The most advantages is that minimize energy loss caused by light reflection because cylindrical refraction is different. It’s easy to understand by looking at the picture below.
This technology is used in Tiger Pro series modules that come with a power rating of up to 580W. Furthermore, multiple bus bar application make lower micro crack loss from 5BB to 9BB or 10BB. Comparing with 5BB, current transmission distance is 50% lower which decreases the power loss by micro crack.
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